Run Semiconductor Design Workflows on AWS

Publication date: March 12, 2021 (Document history)

Abstract

This implementation guide provides you with information and guidance to run production semiconductor workflows on AWS, from customer specification, to front-end design and verification, back-end fabrication, packaging, and assembly. Additionally, this guide shows you how to build secure chambers to quickly enable third-party collaboration, as well as leverage an analytics pipeline and artificial intelligence/machine learning (AI/ML) services to decrease time-to-market and increase return on investment (ROI). Customers that run semiconductor design workloads on AWS have designed everything from simple ASICs to large SOCs with tens of billions of transistors, at the most advanced process geometries. This guide describes the numerous AWS services involved with these workloads, including compute, storage, networking, and security. Finally, this paper provides guidance on hybrid flows and data transfer methods to enable a seamless hybrid environment between on-premises data centers and AWS.